Led light bulbs

ABSTRACT

LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techiques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

FIELD OF THE INVENTION

The present invention relates to solid state lighting devices, includinglight bulbs with one or more light emitting diodes.

DESCRIPTION OF THE RELATED ART

Light emitting diodes (LEDs) are solid state devices that convertelectric energy to light, and generally include one or more activelayers of semiconductor material sandwiched between oppositely dopedlayers. When bias is applied across doped layers, holes and electronsare injected into one or more active layers where they recombine togenerate light that is emitted from the device. Laser diodes are solidstate emitters that operate according to similar principles.

Solid state light sources may be utilized to provide colored (e.g.,non-white) or white LED light (e.g., perceived as being white ornear-white). White solid state emitters have been investigated aspotential replacements for white incandescent lamps. A representativeexample of a white LED lamp includes a package of a blue LED chip (e.g.,made of InGaN and/or GaN), coated with a phosphor (typically YAG:Ce)that absorbs at least a portion of the blue light and re-emits yellowlight, with the combined yellow and blue emissions providing light thatis perceived as white or near-white in character. If the combined yellowand blue light is perceived as yellow or green, it can be referred to as‘blue shifted yellow’ (“BSY”) light or ‘blue shifted green’ (“BSG”)light. Addition of red spectral output from a solid state emitter orlumiphoric material (e.g., phosphor) may be used to increase the warmthof the white light. As an alternative to phosphor-based white LEDs,combined emission of red, blue, and green solid state emitters and/orlumiphors may also be perceived as white or near-white in character.Another approach for producing white light is to stimulate phosphors ordyes of multiple colors with a violet or ultraviolet LED source. A solidstate lighting device may include, for example, at least one organic orinorganic light emitting diode and/or laser.

Many modern lighting applications require high power solid stateemitters to provide a desired level of brightness. Emissions from highpower LEDs are often transmitted through a diffuser to create light of amore diffuse and pleasing character. High power LEDs can draw largecurrents, thereby generating significant amounts of heat that must bedissipated. Heat dissipating elements such as heatsinks are commonlyprovided in thermal communication with high intensity LEDs, since isnecessary to prevent a LED from operating at an unduly high junctiontemperature in order to increase reliability and prolong service life ofthe LED. Aluminum is commonly employed as a heatsink material, owing toits reasonable cost, high thermal conductivity, corrosion resistance,and relative ease of fabrication. Aluminum heatsinks for solid statelighting devices are commonly formed in various shapes by casting,extrusion, and/or machining techniques.

It would be desirable to provide a LED light bulb capable of replacingan incandescent bulb without sacrificing light output characteristics,but various limitations have hindered widespread implementation of LEDlight bulbs. One limitation that has limited widespread implementationof LED light bulbs includes fabrication cost, since assembly of numerousportions of conventional LED light bulbs typically entails assembly byhand—such as to make mechanical, electrical, and thermal (heat transfer)connections. Another limitation associated with conventional LED lightbulbs includes limited directional light output. That is, in the contextof a conventional high-output LED light bulb, at least a portion of aheatsink is arranged between the base and globe (or cover) portions ofthe bulb, with the globe or cover typically serving to protect theLED(s) and diffuse light emitted therefrom. Unfortunately, a heatsink ofsufficient size to dissipate the quantity of heat generated by theLED(s) tends to block output of light proximate to the base of the bulb.When such a bulb is placed pointing upward in a table lamp, theresulting low intensity of light output in an area below the bulb andshadows are not pleasing to many users.

It would be desirable to reduce or eliminate hand assembly steps, andtherefore reduce cost, for fabricating LED light bulbs. It would also bedesirable to enhance heat dissipation in LED light bulbs in order toreduce the need for bulky external heatsinks, and therefore providelight output over a greater range of directions, including enhancedoutput proximate to the base of a LED light bulb. It would also bedesirable to promote lower LED junction temperatures in order to prolongLED operating life.

SUMMARY OF THE INVENTION

The present invention relates to improved LED light bulbs that addressvarious limitations associated with known LED light bulbs.

In one aspect, the invention relates to light emitting diode (LED) lightengine adapted for use in a LED light bulb, the LED light enginecomprising at least one LED mounted to a substrate having patternedthereon at least one electrical trace, the substrate comprising at leastone heat conduit portion with which the at least one LED is arranged inconductive thermal communication, wherein the substrate includes atleast one bend therein to form a substantially rigid upright supportstructure for the at least one LED. An associated aspect relates to aLED light bulb comprising the foregoing light engine.

In another aspect, the invention relates to a method comprising:patterning a substantially planar substrate to define at least oneelectrical trace for at least one light emitting diode (LED); mountingat least one LED to the substrate; and shaping the substrate to defineat least one bend therein to form at least one substantially rigidupright support structure for the at least one LED. Such methods may beutilized in the fabrication of one or more LED light engines, andassociated LED light bulbs.

A further aspect of the invention relates to a light emitting diode(LED) light bulb comprising: a cover defining an interior volume,wherein at least a portion of the cover comprising a material havingvisible spectrum transmittance of least about 80% and a thermalconductivity of at least 25 W/(m·° K) at about 25° C.; and a substratesupporting at least one LED, wherein the at least one LED and at least aportion of the substrate are disposed within the interior volume.

In an further aspect, the invention relates to a light emitting diode(LED) light bulb comprising: a cover defining an interior volume, thecover comprising a material adapted to transmit at least a portion oflight in the visible spectrum; at least one LED disposed within theinterior volume; a support column comprising a plurality of electricalconductors in electrical communication with the at least one LED; andfirst and second electrical contacts disposed in or on the supportcolumn and arranged to mate with an electrical receptacle to receiveelectric current, wherein the first and second electrical contacts arein electrical communication with the plurality of electrical conductors;wherein a portion of the support column is disposed outside of theinterior volume and is exposed to an ambient environment.

A further aspect of the invention relates to a light emitting diode(LED) light bulb comprising: a cover defining an interior volume, thecover comprising a material adapted to transmit at least a portion oflight in the visible spectrum; a substrate supporting at least one LED,wherein the at least one LED and at least a portion of the substrate aredisposed within the interior volume; and at least one opening defined inthe cover, wherein the at least one opening is in fluid communicationwith an ambient environment.

In another aspect, any of the foregoing aspects and/or other featuresand embodiments disclosed herein may be combined for additionaladvantage.

Other aspects, features and embodiments of the invention will be morefully apparent from the ensuing disclosure and appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side elevation view of a LED light bulb accordingto one embodiment of the present invention, including a support columnthat is vented to permit fluid communication between an ambientenvironment and an interior volume of the bulb defined by a cover, withthe support column including an integral screw base portion.

FIG. 2 is a schematic side elevation view of a column portion of a LEDlight bulb according to another embodiment, with the support columnbeing ventilated and including a screw base portion attached thereto.

FIG. 3 is a schematic side elevation view of a LED light bulb accordingto another embodiment, with the support column being ventilated, andwith a cover enclosing an interior volume of the bulb also definingmultiple ventilation ports.

FIG. 4A is a schematic cross-sectional assembly view of a LED light bulbaccording to another embodiment, including a heatpipe within a supportcolumn, and including a preferably removable fan portion arranged toengage the support column and promote forced convective cooling of thelight bulb.

FIG. 4B is a schematic cross-sectional view of the LED light bulb ofFIG. 4A in an assembled state.

FIG. 4C is a schematic side elevation view of a heatsink arranged foruse with a LED light bulb similar to the bulb depicted in FIGS. 4A-4B,as an alternative to the fan portion.

FIG. 5 is a schematic cross-sectional view of a LED light bulb accordingto another embodiment, including a cooling fan and a heatpipe integratedwith a support column of the bulb.

FIG. 6 is a schematic side elevation view of a LED light bulb accordingto another embodiment, including a composite cover arranged to promotecooling of the light bulb.

FIG. 7 is a schematic side elevation view of a LED light bulb accordingto another embodiment, including a cover portion that is opticallytransmissive and thermally conductive, and an internal heat spreaderarranged to conduct heat to the cover portion.

FIG. 8 is a schematic side elevation view of a LED light bulb accordingto another embodiment, including a cover portion that is opticallytransmissive and thermally conductive, with the cover portion definingmultiple fins.

FIG. 9 is a schematic side cross-sectional view of a LED light bulbaccording to another embodiment, including a cover defining an interiorvolume of the bulb, wherein the cover includes ports or openings topermit fluid communication between an ambient environment and theinterior volume of the bulb, and baffles are arranged proximate to theports or openings.

FIG. 10A is a schematic side cross-sectional view of a LED light bulbaccording to another embodiment, including a LED light engine portionformed from a planar substrate to provide mechanical support, electricalcommunication, and thermal conduction for multiple LEDs, wherein thesubstrate has been bent following various planar processing steps toform the light engine.

FIG. 10B is a schematic front elevation view of the LED light enginecontained in the LED light bulb of FIG. 10A.

FIG. 11A is a schematic perspective view of a portion of a substrateincluding first and second edge connectors arranged for mating withelectrical contacts of a socket or fixture to supply electric current toa LED light bulb as disclosed herein, according to another embodiment ofthe present invention.

FIG. 11B is a schematic perspective cross-sectional view of thesubstrate portion of FIG. 11A arranged within a housing of a LED lightbulb and including apertures through which the first and second edgeconnectors may extend for engagement with electrical contacts of asocket or fixture to supply electric current to a LED light bulb asdisclosed herein.

FIG. 12A is a schematic front elevation view of a LED light engineaccording to another embodiment, with the LED light engine including aplanar substrate to provide mechanical support, electricalcommunication, and thermal conduction for multiple LEDs, and the LEDlight engine being adapted for bending into a box-like shape with LEDsarranged on several sides.

FIG. 12B is a simplified schematic perspective view of the LED lightengine of FIG. 12A, following bending of the substrate to form abox-like shape.

FIG. 13 is a schematic side cross-sectional view of a LED light bulbaccording to another embodiment, including a LED light engine similar tothat depicted in FIGS. 12A-12B, occupying a fraction of the length of abase portion of the light bulb.

FIG. 14 is a schematic side cross-sectional view of a LED light bulbaccording to another embodiment, including a LED light engine occupyingsubstantially the entire length of a base portion of the light bulb.

DETAILED DESCRIPTION OF THE INVENTION, AND PREFERRED EMBODIMENTS THEREOF

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which embodiments of theinvention are shown. The present invention may, however, be embodied inmany different forms and should not be construed as limited to thespecific embodiments set forth herein. Rather, these embodiments areprovided to convey the scope of the invention to those skilled in theart. In the drawings, the size and relative sizes of layers and regionsmay be exaggerated for clarity.

Unless otherwise defined, terms (including technical and scientificterms) used herein should be construed to have the same meaning ascommonly understood by one of ordinary skill in the art to which thisinvention belongs. It will be further understood that terms used hereinshould be interpreted as having a meaning that is consistent with theirmeaning in the context of this specification and the relevant art, andshould not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Unless the absence of one or more elements is specifically recited, theterms “comprising,” “including,” and “having” as used herein should beinterpreted as open-ended terms that do not preclude presence of one ormore elements.

As used herein, the terms “solid state light emitter” or “solid statelight emitting device” may include a light emitting diode, laser diodeand/or other semiconductor device which includes one or moresemiconductor layers. A solid state light emitter generates a steadystate thermal load upon application of an operating current and voltageto the solid state emitter. Such steady state thermal load and operatingcurrent and voltage are understood to correspond to operation of thesolid state emitter at a level that maximizes emissive output at anappropriately long operating life (preferably at least about 5000 hours,more preferably at least about 10,000 hours, more preferably still atleast about 20,000 hours).

Solid state light emitters may be used individually or in combinations,optionally together with one or more luminescent materials (e.g.,phosphors, scintillators, lumiphoric inks) and/or filters, to generatelight of desired perceived colors (including combinations of colors thatmay be perceived as white). Inclusion of luminescent (also calledlumiphoric’) materials in LED devices may be accomplished by adding suchmaterials to encapsulants, adding such materials to lenses, or by directcoating onto LEDs. Other materials, such as dispersers and/or indexmatching materials, may be included in such encapsulants.

The present invention relates in various aspects to LED light bulbsproviding at least one of improved thermal characteristics, reducedcomplexity and cost of fabrication, and improved performance.

In one embodiment, a LED light bulb includes a support column with aportion arranged inside an at least partially transmissive cover (alsotermed a “globe”), and a portion extending through the cover and exposedan ambient environment. Such support column may provide structural,electrical, and/or heat transfer functions. In one embodiment, such asupport column may be devoid of a separate (e.g., molded) body disposedaround the support column.

Covers for LED light bulbs according to certain embodiments may beformed of suitably transmissive materials such as (but not limited to)polymeric materials and/or glass. Transmissive materials in this contextreferred to materials adapted to transmit at least a portion of light inthe visible spectrum. A LED light bulb cover may comprise a diffuserarranged to diffuse light emitted by one or more solid state emitters.Such a cover may include one or more lenses to provide focusing,directional pointing, or light shaping utility. A cover mayalternatively, or additionally, include one or more lumiphors (e.g.,phosphors) arranged to interact with light emitted by one or more LEDs(i.e., to receive light emitted by a LED of one peak wavelength andresponsively emit light having at least one other peak wavelength thatdiffers from the peak wavelength of the LED emissions). Variousutilities such as by diffusion, light focusing and/or pointing, andlight conversion may be provided by layers or structures that arecontacting or are spatially segregated from (e.g., disposed within) acover.

A LED light bulb cover may be symmetric or intentionally asymmetric incharacter. A cover associated with a solid state lighting deviceincluding a heatsink is described herein may be provided in any suitablesize or shape, including planar, spherical, hemispherical, and the like.At least a portion of such a cover may resemble a globe in shape.

The term “support column” as used herein is intended in a functionalsense to refer to an element extending in a direction between a base endand a LED emitter of a LED light bulb, and providing direct or indirectsupport for one or more emitters. Direct support in this contextcontemplates mounting of a LED to a surface formed on or over a supportcolumn, whereas indirect support contemplates presence of one or morestructural elements arranged between a support column and a LED. Asupport column is not strictly limited to any particular shape orconformation. In one embodiment, a support column is arranged as atubular element of any desired cross-sectional shape, optionallyincluding at least one hollow portion. In another embodiment, a supportcolumn may be devoid of a hollow interior, and may include flat portionsor substantially planar portions.

A support column extending through a cover of a LED light bulb mayprovide structural support for one or more solid state emitters, mayhave associated electrical conductors to permit electrical communicationwith one or more solid state emitters, and/or provide heat transferand/or heat dissipation utility. Such a support column may include oneor more channels, recesses, or cavities (whether open or closed)arranged to contain operative components (e.g., conductors, controland/or circuit elements, heat transfer elements, sensors, etc.) and/orpermit flow of cooling fluid such as air. Channels, recesses, orcavities formed in a support column of a LED light bulb may be arrangedin any suitable conformation (whether in fluid communication with oneanother or not), such as concentric, side-by-side, intersecting, andnon-intersecting.

In one embodiment, first and second electrical contacts of a LED lightbulb are disposed in or on a support column and are arranged to matewith an electrical receptacle to receive electric current, with theelectrical contacts being electrical communication with at least one LEDby way of electrical conductors arranged in or on the support column. Inone embodiment, at least one LED drive circuit element and/or LEDcontrol circuit element is arranged in or on a support column of a LEDlight bulb. Such circuits may include, but are not limited to drivercircuits, ballast circuits, dimmer circuits, voltage control circuits,current control circuits, color control circuits, electrostaticdischarge elements, sensors and/or sensory feedback circuits,temperature protection circuits, and the like. In one embodiment, thesupport column comprises an electrically conductive material (e.g., ametal), with an electrically insulating material arranged in or on atleast one portion thereof. Such insulating material may be formed as acoating or covering arranged over at least a portion of the supportcolumn. In one embodiment, a support column comprises an electricallyinsulating material with at least one electrically conductive materialarranged therein or thereon. In preferred embodiments, an externallyaccessible surface of the support column comprises an electricallyinsulating material to prevent electric shock by a user contacting sucha column. In one embodiment, a support column defines a lateral contractand a foot contact of an Edison-type threaded light bulb connector. Inanother embodiment, one or more contacts of an Edison-type threadedlight bulb connector are prefabricated (e.g., in the form of a cap) andfitted to a support column by mechanical engagement. Although variousembodiments disclosed herein include Edison-type threaded connectors, itis to be appreciated that LED light bulbs may be formed with electricalconnectors of any suitable type known or developed in the art.

In one embodiment, a support column comprises one or more LED mountingsurfaces arranged to receive LEDs. When multiple LED mounting surfacesare provided, such services may be non-coplanar to one another, topermit light from different LEDs to be emitted in different directions.In various embodiments, LED mounting surfaces may be flat, raised, orrecessed. And LED mounting surface may have associated therewith atleast one heat spreader and/or heatsink arranged to spread and/ordissipate heat generated by at least one LED. Heat spreaders and/orheatsinks associated with a LED mounting surface may or may not beelectrically active. Thermal contact may be enhanced by use of thermallyconductive paste or other suitable heat transfer enhancement media.Electrical connections between a mounting surface and a LED may be madeby soldered surface connections and/or wirebonds. In one embodiment, oneor more LED mounting surfaces are integrally formed in or on a supportcolumn of a LED light bulb. In another embodiment, one or more LEDmounting surfaces are formed on a prefabricated element arranged forcoupling to at least one portion of a support column.

In certain embodiments, a support column includes at least one openingor port in fluid communication with the interior volume defined by thecover to permit fluid communication with an ambient environment.Movement of air or other fluid through one or more openings or ports mayoccur through natural convection, may be motivated by one or more fluidcirculation elements (e.g., fans, blowers, fluid pumps, charged elementsto promote ionic air movement, or the like) arranged in or on a LEDlight bulb, or may be driven by pressure supplied by an external fluidsource.

In certain embodiments, various types of heat transfer elements may beassociated with a support column of a LED light bulb. A support columnmay include or have associated there with at least one of the following:a heatpipe, an internal fan or blower, and external fan or blower, athermoelectric cooler, a thermally conductive heat spreader, andthermally conductive heatsink (e.g., including a plurality of fins).Multiple heat transfer elements of different types may be combined in asingle LED light bulb. In one embodiment, a LED light bulb may includeone or more portions of arranged for nondestructive removal in order topermit changing or servicing of a heat transfer element or othercomponent.

In certain embodiments, a cover portion of a LED light bulb defines aninterior volume containing at least one LED disposed therein, and thecover portion defines at least one opening or port in fluidcommunication with an ambient environment. At least one additional portmay be defined in the cover and/or a base (e.g., column) portion of theLED light bulb to enable circulation of air or other fluid through themultiple openings or ports, to enable convective cooling of at leastcertain portions of the LED light bulb. A first opening or port may bedefined in a cover, and a second opening or port may be defined in asupport column, with a channel defined in the support column extendingbetween the first and the second opening or port to provide fluidcommunication therebetween through the support column. In oneembodiment, a cover may comprise multiple portions, with a port oropening defined between such portions.

In one embodiment including a LED light bulb cover defining at least oneopening, at least one baffle is provided and arranged to preventunobstructed visibility of at least one LED. Such baffle is preferablyat least partially transmissive of at least one wavelength in thevisible range, and may be formed of substantially the same material asthat of the cover, or formed of a different material from that of thecover. Multiple openings and multiple baffles may be provided. A bafflemay be provided within the interior volume defined by the cover, or maybe provided outside the cover. A baffle may be integrally formed withthe cover, or may be separately formed and affixed to the coverfollowing fabrication thereof. One or more spacing elements may beprovided between a baffle and the cover to ensure that the baffle isdisposed apart from the cover. In one embodiment, a baffle comprises asecondary covering element (including multiple holes therein) arrangedover at least one LED, with the cover comprising a primary coveringelement arranged over such baffle.

In one embodiment, an opening defined in the cover of a LED light bulbhas associated therewith a filter element arranged to inhibit passage ofdust or other particulate matter into the interior volume defined by thecover. Such filter element (which may be disposed along an externalsurface of the cover and/and mechanically retained with one or moreclips, snap fittings, magnets, wires, or other retaining elementsarranged to cooperate with the cover or another portion of the lightbulb) may removable in character to permit the filter element to beperiodically cleaned or changed. In one embodiment, one or more sensors(e.g., optical sensor, thermal sensor, pressure sensor, differentialpressure sensor, operating time sensor, and/or airflow sensor, etc.) maybe arranged to sense a condition indicative of a need for a filter to becleaned or changed, and the LED light bulb may cause a user to bealerted to such condition. Such alert may be in the form of an audibleor visible alarm, any change in operating condition of the LED lightbulb, or other user perceptible interaction. In one embodiment, a filterelement includes an authentication element arranged for communicationwith at least a portion of a LED light bulb. Such authentication elementmay include a radio frequency identification tag, a microchip, anEEPROM, or other information containing medium suitable for outputting asignal to be received a corresponding interrogation or reading elementof a LED light bulb. An authentication element may optionally engage ina challenge-and-response authentication scheme. Through use of anauthentication element, a manufacturer of a LED light bulb may ensurethat only a filter approved by the manufacturer may be used inconjunction with the LED light bulb, such as to minimize warrantyexposure.

In one embodiment, a LED light bulb included a cover adapted to provideboth light transmission and heat dissipation utility. Typical LED lightbulbs include conventional glass or polymeric covers (e.g., diffusersand/or lenses), with such covers generally constituting thermalinsulators. Heating of conventional polymeric covers may be avoided toprevent discoloration and/or deformation of such material. To provideenhanced heat dissipation utility, in certain embodiments according tothe present invention, at least a portion of a cover for a LED lightbulb may comprising a material having reasonably high visible spectrumtransmittance (e.g., at least about 80%, more preferably at least about85%, more preferably at least about 90%, more preferably at least about95%, more preferably at least about 97% of at least one wavelength inthe visible range) together with high thermal conductivity (i.e., at atemperature of about 25° C. or 298° K, since thermal conductivity istemperature dependent). Such high thermal conductivity may be at leastabout 25 W/(m·° K), more preferably at least about 50 W/(m·° K), morepreferably at least about 75 W/(m·° K), more preferably at least about100 W/(m·° K), more preferably at least about 150 W/(m·° K), and morepreferably at least about 200 W/(m·° K), including ranges of theforegoing minimum values optionally bounded by an upper thresholdthermal conductivity of up to about 210 W/(m·° K). Examples of materialsexhibiting both (a) visible spectrum transmittance within one or more ofthe foregoing ranges, and (b) high thermal conductivity within one ormore of the foregoing ranges, include, but are not limited to, sinteredsilicon carbide, crystalline silicon carbide, and high thermalconductivity glass (e.g., comprising indium tin oxide).

In one embodiment, a thermally conductive cover for a LED light bulbcomprises a plurality of fins. Such fins may be formed, for example, bysintering (heating of powdered precursor material, often with anadditional binder material) and/or by machining. In one embodiment, athermally conductive cover for a LED light bulb serves as an opticaldiffuser or at least one lens. In one embodiment, a thermally conductivecover for a LED light bulb includes or has associated therewith alumiphoric material arranged to downconvert emissions from the at leastone LED.

In one embodiment, a heat spreader and/or heatsink associated with a LEDlight bulb is arranged in conductive thermal communication with at leastone LED and with a thermally conductive cover as described herein. Inone embodiment, a thermally conductive cover for a LED light bulbcomprises at least one opening, optionally including at least onebaffle, as described herein.

In one embodiment, substantially all of a thermally conductive covercomprises a material having visible spectrum transmittance of leastabout 80% and a thermal conductivity of at least 25 W/(m·° K). Inanother embodiment, a cover comprises different materials. In oneexample, a cover includes a first cover portion comprising a materialhaving visible spectrum transmittance of least about 80% and a thermalconductivity of at least 25 W/(m·° K), and a second portion having avisible spectrum transmittance of less than about 80% and a thermalconductivity of greater than 25 W/(m·° K). The first and second portionsmay be coupled along an interface arranged to promote conductive heattransfer therebetween.

In certain embodiments, fabrication of LED light bulbs may be simplifiedthrough use of LED light engines fabricated utilizing techniquessuitable for planar substrates (e.g., circuit boards), and then shapingsuch a substrate with at least one bend therein to form a substantiallyrigid upright support structure for at least one LED. A LED light enginemay be formed from a planar substrate to provide mechanical support,electrical communication, and thermal conduction for one or multipleLEDs. In one embodiment, a substrate is shaped to form multiplenon-coplanar LED support surfaces adapted to support a plurality ofLEDs. Shaping of the substrate may be performed before or after themounting of at least one LED to the substrate. In one embodiment, asubstantially rigid “upright” support structure defines a gap arrangedbelow a substrate mounting layer or portion, preferably internal to thelight engine. Such gap is consistent in character with the uprightnature of the light engine according to one embodiment, as distinguishedfrom a conventional LED package including a molded polymeric bodysurrounding at least a portion of a leadframe, wherein contact portionsof the leadframe may be bent downward for mounting to a target surface.In one embodiment, a LED light engine as disclosed herein is devoid of apolymeric body structure encasing at least a portion of a conductivemetal portion of a substrate, as further distinguished from aconventional LED package.

In one embodiment, a substantially planar substrate may be patterned todefine at least one electrical trace (and preferably multiple electricaltraces) for LEDs and associated one circuit element(s). LEDs and variouscircuit elements (e.g., LED drive control elements and/or LED controlcircuit elements) may be mounted to, defined in, or defined on asubstrate. LEDs and/or circuit elements may be arranged on one and/orboth sides of a single substrate The substrate may be shaped to defineat least one bend therein to form the substantially rigid uprightsupport structure. Such a support structure is preferablyself-supporting, without requiring use of additional rigid support toretain a desired position.

One advantage of using techniques suitable for planar substrates is thatmultiple substrates may be fabricated simultaneously, and then cut intomultiple segments or formation of multiple LED light engines. Forexample, electrical traces for a multitude of LEDs and electricalcircuit elements may be patterned on at least one surface of asubstrate. Multiple LEDs may be mounted in and/or on the substrate. Thesubstrate may then be cut into multiple segments, with each segmentbeing subject to one or more shaping steps to define at least one bendtherein for formation of LED light engine embodying substantially rigidsupport structures. LED light engines may be formed into any of variousshapes, including open and closed forms.

In one embodiment, a substrate comprises a metal core print circuitboard (PCB). In one embodiment, a substrate include a stamped metallayer and at least one electrically insulating layer. In one embodiment,a substrate comprises at least one heat conduit portion, and at leastone LED may be arranged for mounting in conductive thermal communicationwith the heatsink portion. In one embodiment, a substrate comprisesportions of different thicknesses. For example, metal of a first gaugemay be utilized for formation of heat electrical traces, and metal of asecond (e.g., thicker) gauge may be utilized for formation of heatconduit portions (e.g., as may be appropriate for supporting LEDs and/orcircuit elements associated with LEDs. In one embodiment, a substratecomprises portions fabricated from of different metals, such as a copperportion for use in forming electrical traces, and an aluminum portionfor use in forming a heat conduit or heatsink In one embodiment, a heatconduit portion of the substrate is arranged to extend or protrudethrough a base portion or housing of a LED light bulb. In oneembodiment, a heat conduit portion comprises a heatsink with a pluralityof fins. In one embodiment, a heat conduit portion of a LED light enginemay be arranged in conductive thermal communication with a secondaryheatsink having at least one surface arranged external to the LED lightbulb. A heat conduit portion of a LED light engine may be electricallyactive, or may be electrically isolated from the at least one LED orother circuit elements and/associated therewith.

A base end of a LED light engine may include electrical contactsarranged to mate with or engage an electrical receptacle (e.g., a socketor fixture) to receive electric current, for supply of same to at leastone LED affixed to the light engine. In one embodiment, a substratecomprises at least one edge connector adapted to engage at least oneelectrical contact of a receptacle (e.g., socket or fixture) to supplyelectrical current to the LED light engine. Various details relating toedge connectors are disclosed in U.S. patent application Ser. No.12/730,802 filed on Mar. 24, 2010 and entitled INTERFACE AND FABRICATIONMETHOD FOR LIGHTING AND OTHER ELECTRICAL DEVICES, with such applicationhereby being incorporated by reference herein in its respectiveentirety, for all purposes. One or more edge connectors may extendthrough one or more apertures (e.g., slots) defined in a support columnor housing of a LED light bulb. Such support column or housing may beelectrically insulating.

In one embodiment, a LED light engine may occupy only a fraction of thelength of the base portion of a LED light bulb. Such a LED light enginemay be arranged for mounting with one or more underlying support and/ormounting elements. In another embodiment, a LED light engine may occupysubstantially the entire length of the base portion of a LED light bulb.A LED light engine may be inserted into a base or housing or protectionthereof. Such base or housing may include an external heatsink arrangedin conductive thermal communication with at least one heatsink portionof the LED light engine.

Various advantages and features according to the present invention areillustrated with reference to the drawings.

FIG. 1 illustrates a LED light bulb 10 according to one embodiment ofthe present invention. The light bulb 10 includes a base end 11,multiple LEDs 45-47 arranged within an interior volume 30 defined by acover 30, and a support column 20 extending between the base end 11 andthe cover 30. Provided along the base end 11 are a foot contact 15 and alateral contact 16 arranged for mating with a threaded Edison-typesocket. The LEDs 45-47 are arranged on multiple LED mounting surfaces41-43, respectively. Such LED mounting surfaces 41-43 may be formedconcurrently with the support column 20, or may be arranged on aprefabricated section 40 arranged for coupling to the support column 20.The support column 20 may be fabricated with an internal portion ofelectrically conductive material having a layer or coating ofelectrically insulating material 29 arranged over exposed portionsthereof, so as to prevent electric shock by user contacting the supportcolumn 20. In such an embodiment, one or both of the lateral contact 16and the foot contact 15 (which may be segregated by an annularinsulating element (not shown)) may be integrally formed with thesupport column 20. The support column 20 has defined therein multiplefirst ports or openings 26 arranged along an external surface, andmultiple second ports or openings 28 disposed within the cover 30. Oneor more passages or channel (not shown) may be arranged within or alongan external surface of support column 20, to permit movement of airbetween the multiple ports or openings 26, 28 such that the interiorvolume 31 is in fluid communication with an ambient environment. Sucharrangement permits escape of heat from the interior volume 31, therebyreducing the need for heat sinks in order to cool the LED light bulb 10.

FIG. 2 illustrates at least a portion of a LED light bulb similar to thebulb 10 shown in FIG. 1, with the portion being devoid of a cover, andincluding an electrically insulating support column 20A extending (a)between a prefabricated base contact portion including a base end 11A, afoot contact 15A, and a lateral contact 16A, and (b) a prefabricatedsection 40A including LED mounting surfaces to which LEDs 45A-47A,respectively, are mounted. Each of the base contact portion and theprefabricated section 40A may be affixed to the support column 20A byany suitable joining method, including mechanical coupling, adhesives,and/or similar methods.

FIG. 3 illustrates another LED light bulb 110 similar to the embodimentshown in FIG. 1, with the addition of a fluid circulation element 50 tothe support column 120, and the addition of multiple ports or openings132, 133 in the cover 130 and associated baffles 133, 134. The lightbulb 110 includes a base end 111, multiple LEDs 145-147 arranged withinan interior volume 131 defined by a cover 130, and a support column 120extending between the base end 111 and the cover 130. Electricalcontacts 115, 116 are arranged proximate to the base end 111. Thesupport column 120 includes an electrically insulating material layer129 disposed along and outside surface thereof. The support column 120has defined therein multiple first ports or openings 126 arranged alongan external surface, and multiple second ports or openings 128 disposedwithin the cover 130. Air movement between such ports or openings126-128 may be aided by a fluid circulation element 150, which may beembodied in a fan or blower. The ports or openings 132, 133 defined inthe cover 130 have baffles 134, 135 arranged proximate thereto,preferably positioned to prevent unobstructed visibility of the LEDs141-143. Each of the cover 130 and the baffles 134, 135 is preferably atleast partially transmissive of at least one wavelength in the visiblerange, with the baffles 134, 135 and the cover 130 optionally be formedof substantially the same material.

Natural convection is a phenomenon that causes heat to rise; however theLED light bulb 110 may be positioned either upward or downward, so it ispossible that forced convective flow (e.g., as motivated by the fluidcirculating element 150) within the LED light bulb 110 may operating ina direction counter to natural convective flow. In order to avoid suchcounter-active effect, in one embodiment a LED light bulb may include asensor arranged to sense mounting direction sensor, wherein circulationdirection of the fluid circulating element 150 is controlled responsiveto an output of such a sensor.

FIGS. 4A-4B illustrate a LED light bulb to 10 according to anotherembodiment, including a heat pipe to 55 within a support column 220,including a preferably removable exteriorly arranged fluid circulating(e.g., fan) portion 260 arranged to engage the support column 220 andpromote forced convective cooling of at least a portion of the LED lightbulb 210. The fluid circulating portion 260 defines an aperture 261arranged to permit the fluid circulating portion 260 to fit over theexterior of at least a portion of the support column 220.

The light bulb 210 includes a base end 211, multiple LEDs 245-247arranged within an interior volume 231 defined by a cover 230, and asupport column 220 extending between the base end 211 and the cover 230.The LEDs 245-247 are arranged over support surfaces 241-243 inconductive thermal communication with an internal heat spreader 249arranged in contact with a heatpipe 255 arranged to transport heat in oralong the support column 220 in a direction from the heat spreader 249toward the base end 211. Electrical contacts 215, 216 are arranged formating with an external electrical receptacle are arranged near the baseend 211. Additional electrical contacts 256, 257 are provided along thesupport column 220 for mating with corresponding contacts 266, 267 ofthe fluid circulating portion 260 in order to provide electric power tofluid circulating elements 265A-265B.

At least one sensor 259 may be arranged to sense one or more conditions(e.g., temperature, airflow, pressure differential, electric flow, etc.)indicative of needs to initiate or adjust operation of the fluidcirculating elements 265A-265B, to limit operation of the LEDs 245-247,to clean or change the fluid circulating elements 265A-265B (or theentire fluid circulating portion 260), and so on. In one embodiment, afluid circulating portion 260 includes an authentication elementarranged for communication with at least a portion of a LED light bulb.Such authentication element may include a radio frequency identificationtag, a microchip, an EEPROM, or other information containing mediumsuitable for outputting a signal to be received a correspondinginterrogation or reading element of a LED light bulb. In this manner, amanufacturer of a LED light bulb may ensure that only a fluidcirculating element approved by the manufacturer may be used inconjunction with the LED light bulb, such as to minimize warrantyexposure.

As an alternative to the fluid circulating element 260, a heatsink 270including multiple fins 271 may be fitted over an exterior portion ofthe support column 220 to promote passive cooling of the LED light bulb210.

Referring to FIG. 5, a LED light bulb according to another embodimentincludes a fluid circulating elements 350 and a heat pipe 355 integratedwithin a support column 320 of the light bulb 310. The light bulb 310includes a base end 311, multiple LEDs 345-347 arranged within aninterior volume 331 defined by a cover 330, and a support column 320extending between the base end 311 and the cover 330. Electricalcontacts 315, 316 are arranged proximate to the base end 311. The LEDs345-347 are arranged on support surfaces 341-343 in conductive thermalcommunication with an internal heat spreader 349 arranged in contactwith a heatpipe 355 arranged to transport heat in or along the supportcolumn 320 in a direction from the heat spreader 349 toward the base end311. An opening 320A may be defined in the support column 320 to permitmovement of air across one end of the heat pipe 355. At least one sensor359 may be arranged to sense one or more conditions (e.g., temperature,airflow, pressure differential, electric flow, etc.) indicative of needsto initiate or adjust operation of the fluid circulating element 350, tolimit operation of the LEDs 345-347, to clean or replace the fluidcirculating element 350, and so on.

FIG. 6 illustrates a LED light bulb 410 according to another embodimentincluding a composite or multi-part exterior enclosing an interiorvolume 431. Arranged near a base end 411 are electrical contacts415-416. Disposed between an upper cover portion 430 and the base end isa lower portion 470 that includes multiple cooling fins 471. In oneembodiment, the lower portion 470 comprises a material having hightransmittance and high thermal conductivity (e.g., visible spectrumtransmittance of least about 80% and a room temperature thermalconductivity of at least 25 W/(m·° K) at about 25° C.) with multiplefins 471 formed therein, and the upper cover portion 430 is devoid offins. The upper cover portion 430 may be formed of the same material as,or a different material from, the lower portion 470. The upper coverportion 430 and lower portion 470 may have different thicknesses,surface finishes or patterns, and/or comprise different materials toimpart different optical properties to beams emitted in differentdirections (e.g., above or below a boundary 469) from the bulb 410. Inone embodiment, the lower portion 470 comprises a substantiallynon-transmissive material (e.g., metal) and the upper portion comprisesa material having high transmittance and high thermal conductivity asdescribed above, and the boundary 469 is arranged to promote thermalconduction therebetween (e.g., with thermally conductive paste or otherconductivity enhancing substances).

One or more light-affecting materials or structures 434 may beassociated with (e.g., formed in or on) the upper cover portion 430, ordisposed between the upper cover portion and emitters arranged with thedevice (which may be arranged proximate to the boundary 469). Suchlight-affecting material(s) or structure(s) 434 may include, but are notlimited to, one or more diffusing elements, wavelength convertingelements, light focusing elements, or light shaping elements.

FIG. 7 illustrates a LED light bulb 510 according to another embodiment,including a substrate with a heat spreader 549 for multiple LEDs 545 inconductive thermal communication (at contact surface 548) with one orboth of a lower portion 570 and an upper cover portion 530 fordissipation of heat to an ambient environment. Mounting of LEDs to asubstrate supported by an outer wall (e.g., upper cover portion 570and/or lower portion 530) may eliminate need for an interior supportcolumn. Arranged near a base end 511 are electrical contacts 515-516.Conductors (not shown) may extend from the contacts 515-516 to asubstrate supporting the LEDs 545 by any appropriate means, includinguse of individual wires, a flexible ribbon connector, a circuit boardportion, or the like. In one embodiment, the upper cover portion 530 andthe lower cover portion 570 constitute one continuous element. Inanother embodiment, the upper cover portion 530 comprises a materialhaving high transmittance and high thermal conductivity, and the lowerportion has differing thermal and/or optical transmissivitycharacteristics. The upper cover portion 530 and lower portion 570 mayhave different thicknesses, surface finishes or patterns, and/orcomprise different materials to impart different optical properties tobeams emitted in different directions (e.g., above or below a boundaryalong the heat spreader 549. In one embodiment, the lower portion 470comprises a substantially non-transmissive material (e.g., metal) andthe upper portion comprises a material having high transmittance andhigh thermal conductivity as described above.

FIG. 8 illustrates a LED light bulb 610 according to another embodiment,including a cover 630 comprising a material having high transmittanceand high thermal conductivity, and defining multiple fins 637. Such fins637 may or may not extend to a lower portion 633 arranged proximate tocontacts 616, 615 disposed near a base end 611. The fins 637 may beformed, for example, by sintering (heating of powdered precursormaterial) and/or by machining. In one embodiment, the fins 637 arealigned in a generally longitudinal direction, generally perpendicularthreads of the lateral contact 616. In another embodiment, fins 637 maybe aligned in a generally transverse direction, in a diagonal direction,or in several directions. The number, direction, height, width, spacing,and surface finish of the fins may be selected to optimize one or bothof thermal and optical characteristics.

FIG. 9 illustrates a LED light bulbs 710 according to anotherembodiment, including a cover 730 that includes multiple ports oropenings 732, 733, and baffles 734, 735 disposed proximate to the portsor openings 732, 733. The LED light bulb 710 includes electrical contact715, 716 disposed near a base end 711. A support element 720 is arrangedwithin an interior volume 731 defined by the cover 730, with the LEDs745-747 arranged on multiple surfaces 741-743 thereof. Such baffles 734,735 are preferably arranged to prevent unobstructed visibility of LEDs745-747. Such baffles 734, 735 may be integrally formed with the cover730, or may be separately formed and affixed to the cover 730 followingfabrication thereof. One or more spacing elements (not shown) may beprovided between a baffle baffles 734, 735 and the cover 730 to ensurethat spacing is maintained therebetween.

FIG. 10A illustrates a LED light bulb 810 and a LED light engine 880suitable for use in fabricating the LED light bulb 810, and FIG. 10Billustrates the LED light engine 880 during fabrication thereof.Referring to FIG. 10B, a substrate 895 for use in fabricating the LEDlight engine 880 may include at least one electrically conductive layerand at least one electrically insulating layer, such as may be embodiedin a metal core printed circuit board, or a layer of metal of uniform ornon-uniform thickness to which one or more insulating layers have beenapplied. Various portions 881-884 of the substrate 895 extend betweenbend zones 878A-878C. Upon bending or other shaping of the substrate,the substrate portions 881-884 may be arranged in a non-coplanarconformation to yield a substantially rigid upright support structure,such as illustrated in FIG. 10A. Electrical traces (not shown) formultiple LEDs 845 and electrical circuit elements 869 may be patternedon at least one surface of a substrate 895, and the LEDs 845 and circuitelements 869 may be mounted or deposited on or over the substrate 895.Although in one embodiment it is preferred to complete all patterningand mounting steps prior to bending of the substrate, the steps ofshaping (e.g., bending) of the substrate 895 and mounting of one or moreelements thereon may be performed in any desired order.

FIG. 10A shows the LED light engine 880 arranged within a LED light bulb810. A base portion 881 of the LED light engine 880 is arrangedproximate to the base and contacts 815, 816 of the light bulb 810. Thebase end 881 of the LED light engine 880 may be used for physicalmounting, electrical connections, and or heat conduction. An uprightportion 882 of the light engine is arranged along a longitudinal axis ofthe LED light bulb 810, supporting an angled portion 883 and atransverse cantilever portion 884 on which the LEDs 845 are mounted.Various bends 879A-879C are arranged between the foregoing portion,corresponding to the bend zones 878A-878C illustrated in FIG. 10B. TheLED light engine 880 is arranged within an interior volume 831 definedby a cover 830 of the LED light bulb 810. Any of the various LED lightbulb covers as disclosed herein may be utilized in connection with thebulb 880.

FIG. 11A illustrates a portion of a substrate 980 including first andsecond edge connectors 915, 916 arranged for mating with electricalcontacts of an external receptacle (e.g., socket or fixture) to supplyelectric current to a LED light bulb as disclosed herein. The substrate980, which preferably includes a printed circuit board having varioustraces thereon (not shown) may include a narrowed end portion 982A topermit insertion thereof into a narrow end of a LED light bulb arrangedfor mating with an Edison-type threaded socket. A foot contact 915 isarranged at a lower end 911 of the substrate 982, and a lateral contact916 comprises a fluted edge defining protrusions and grooves arranged tofollow the lateral profile of threads of the screw-shaped male base(e.g., threaded surface 927 of bulb 910 illustrated in FIG. 11B) of aLED light bulb arranged to mate with an Edison-type threaded socket. Asshown in FIG. 11B, the substrate 980 may be arranged for mounting withina housing 920 of a LED light bulb 910 including an external heatsink971, a first aperture (e.g. slot) 925 for receiving the foot contact 915of the substrate 980, and a second aperture (e.g., slot) 926 forreceiving the lateral contact 916 of the substrate 980. With thecontacts 915, 916 extending through respective apertures in the housing920, electrical contact may be made directly between the light engineand an electrical receptacle. Various features of the substrate 980 andbulb housing 920 may be integrated with a substrate of a LED lightengine and related LED light bulb, respectively, as disclosed herein.

FIGS. 12A-12B illustrate another light engine 1080 arranged for use witha LED light bulb. Various manufacturing steps developed for processingof planar substrate may be applied to the substantially planar substrate1095. A single carrier may be patterned and processed simultaneously,and then subjected to stamping or other cutting steps to yield multipleindividual substrates 1095. Various electrical traces 1091 may be formedin or on one or more surfaces of the substrate 1095 to provideelectrical connections for LEDs 1041-1045 and related circuit elements,control elements, and optional sensors 1069A-1069C. The particularsubstrate shape, panel configuration, number and placement of emittersand control components, and size and placement emitter traces shown inFIG. 12A are for purposes of illustration only; one skilled in the artwould recognize upon review of the present disclosure that numerousvariants of these and other features are possible. Regarding theelectrical traces and control schemes, in one embodiment, groups ofemitters may be individually controlled. In another embodiment, each LEDmay be controlled independently.

Various panels or portions 1081-1087 of the substrate 1095 extendbetween bend zones 1078A-1078E. Cuts 1099 may be defined betweenadjacent panels 1082, 1087 and 1083, 1086. A heat conduit portion 1087having associated mounting elements (e.g., holes or protrusions) 1088 isarranged in conductive thermal communication with the LEDs 1045.Multiple heat conduit portions may be provided; in one embodiment, oneor more of the side panels 1082-1084 may be devoid of LED and serve asadditional thermal conduit panels. A conduit portion 1087, andoptionally the panel 1085 underlying the LEDs 1041-1085 and the panel1086 underlying the circuit elements 1069A-1069C, may comprise thickerconductive material (e.g., metal gauge) than conductive material withwhich one or more other panels 1081-1085 are formed, in order to promoteenhanced heat transfer and provide a preferential thermal escape pathvia such panels 1085-1087. One or more panels 1081-1087 of the device,especially including the heat conduit panel 1087 and any panels 1085,1086 that also may be characterized by enhanced thickness, may includeone or more fins. Following various planar processing steps (e.g.,deposition of insulating material, formation of electrical traces,mounting or addition of circuit elements 1069A-1069C, and possiblymounting the LEDs 1041-1045 (since such mounting may be performed aftercutting and/or shaping steps)), the substrate 1097 may be cut asnecessary (e.g., to form cut portions 1099 and/or segregate thesubstrate from adjacent portions of a carrier) and shaped to form a LEDlight engine 1080. Upon bending or other shaping of the substrate 1091,the substrate portions 1081-1087 may be arranged in a non-coplanarconformation to yield a substantially rigid upright support structure1080, such as illustrated in FIG. 12B. In one embodiment, a LED lightengine as disclosed herein comprises multiple electrical connectors. Anelectrical edge connector portion 1090 including multiple contacts maybe formed as an extension of one LED support panel 1081. If desired, aportion of the substrate 1095 may be arranged to include edge connectors911, 915 such as shown in FIG. 11A.

Continuing to refer to FIGS. 12A-12B, one or more panels (e.g., panel1086) containing electrical control components 1069A-1069C may be foldedand placed in an interior portion of a structure bounded by theremaining panels. An end portion 1087A of the heat conduit panel 1087may be further bent if desired to facilitate mounting. In oneembodiment, the end portion 1087A of a heat conduit panel 1087 may bearranged for contacting mounting with one or more LED light bulbheatsink elements (not shown) positioned for exposure to an ambientenvironment. In one embodiment, a portion of the heatsink panel 1087 (ormultiple heatsink panels) may protrude through a housing of a LED lightbulb for exposure to an ambient environment.

LED light engines as disclosed herein may be variously utilized with LEDlight bulb components as disclosed herein, and variously placed andmounted within LED light bulbs.

FIG. 13A illustrates a LED light bulb 1010 according to anotherembodiment, including a LED light engine 1080 substantially similar tothat depicted in FIGS. 12A-12B, occupying a fraction of the length of abase portion 1020 of the light bulb 1010. The base portion may have anassociated externally accessible heatsink 1070. The light bulb 1010includes electrical contacts 1015, 1016 arranged near a base end 1011. Acover 1030 defines an interior volume 1031 in which LEDs 1041-1045 ofthe LED light engine 1080 are contained. An edge connector portion 1090extending from one panel 1081 of the LED light engine may mate with anassociated structure (e.g., socket) of a base element 1048, andmechanical and thermal connections (e.g., optionally including screws,compression fittings, or other connectors) may further be provided topromote mounting and heat transfer. If desired, one or more electricalcircuit elements (e.g., control circuits) may be arranged in the baseelement 1048, in addition to or instead of providing such circuits inthe LED light engine 1080. In one embodiment, a light engine 1080 ismated with (e.g., by insertion into) a prefabricated base element 1048,for making of mechanical, electrical and thermal connections to the baseelement 1048, and the cover 1031 is affixed to yield a LED light bulb1010.

FIG. 14 illustrates a LED light bulb 1110 according to anotherembodiment, including a LED light engine 1180 occupying substantiallythe entire length of a base portion of the light bulb 1110. The LEDlight bulb 1110 includes a cover portion 1130 defining an interiorvolume in which multiple LEDs 1141, 1142, 1145 are contained. The LEDlight engine 1180 may be inserted into a prefabricated body 1120including a heatsink 1170, with establishment or immediate provision ofmechanical, thermal, and electrical connections. In one embodiment, theLED light engine 1180 includes edge connectors 1115, 1116 arranged forinsertion through corresponding apertures disposed in the prefabricatedbody 1020. In one embodiment, thermal connection between the LED lightengine 1180 and a heatsink 1070 associated with the prefabricated body1120 are made by an insertable connection (alternatively, suchconnection may be aided by clamping, screwing, or the like). In oneembodiment, press-fit or retainably insertable mechanical connection isprovided between the LED light engine and the prefabricated bodystructure 1120. In certain embodiments, at least two, or all three, ofthe foregoing electrical, mechanical, and thermal connections between aLED light engine and a prefabricated body portion 1120 are madesimultaneously by or upon insertion of the LED light engine 1180 intothe body portion 1120.

One embodiment of the present invention includes a light fixture with atleast one solid state lighting device (e.g., LED light bulb) as disposedherein. In one embodiment, a light fixture includes a plurality of solidstate lighting devices. In one embodiment, a light fixture is arrangedfor recessed mounting in ceiling, wall, or other surface. In anotherembodiment, a light fixture is arranged for track mounting. A solidstate lighting device may be may be permanently mounted to a structureor vehicle, or constitute a manually portable device such as aflashlight.

In one embodiment, an enclosure comprises an enclosed space and at leastone solid state lighting device or light fixture as disclosed herein,wherein upon supply of current to a power line, the at least onelighting device illuminates at least one portion of the enclosed space.In one embodiment, a method utilizes a LED light bulb includingelectrical traces as disclosed herein, and comprises supplying electriccurrent to the plurality of electrical traces to illuminate at least oneLED.

In another embodiment, a structure comprises a surface or object and atleast one solid state lighting device (e.g., LED light bulb) asdisclosed herein, wherein upon supply of current to a power line, thesolid state lighting device illuminates at least one portion of thesurface or object. In another embodiment, a solid state lighting deviceas disclosed herein may be used to illuminate an area comprising atleast one of the following: a swimming pool, a room, a warehouse, anindicator, a road, a vehicle, a road sign, a billboard, a ship, a toy,an electronic device, a household or industrial appliance, a boat, andaircraft, a stadium, a tree, a window, a yard, and a lamppost.

While the invention has been has been described herein in reference tospecific aspects, features and illustrative embodiments of theinvention, it will be appreciated that the utility of the invention isnot thus limited, but rather extends to and encompasses numerous othervariations, modifications and alternative embodiments, as will suggestthemselves to those of ordinary skill in the field of the presentinvention, based on the disclosure herein. Correspondingly, theinvention as hereinafter claimed is intended to be broadly construed andinterpreted, as including all such variations, modifications andalternative embodiments, within its spirit and scope.

1. A light emitting diode (LED) light engine adapted for use in a LEDlight bulb, the LED light engine comprising at least one LED mounted toa substrate having patterned thereon at least one electrical trace, thesubstrate comprising at least one heat conduit portion with which the atleast one LED is arranged in conductive thermal communication, whereinthe substrate includes at least one bend therein to form a substantiallyrigid upright support structure for the at least one LED.
 2. The LEDlight engine of claim 1, wherein the at least one electrical tracecomprises a plurality of electrical traces.
 3. The LED light engine ofclaim 1, wherein the at least one heat conduit portion comprises, or isin conductive thermal communication with, a heatsink
 4. The LED lightengine of claim 1, further comprising any of a LED drive circuit elementand a LED control circuit element mounted to, defined in, or defined onthe substrate.
 5. The LED light engine of claim 1, wherein the substratecomprises a metal core printed circuit board.
 6. The LED light engine ofclaim 1, wherein the substrate comprises a stamped metal layer and atleast one electrically insulating layer.
 7. The LED light engine ofclaim 1, wherein the at least one heat conduit portion is electricallyisolated from the at least one LED.
 8. The LED light engine of claim 1,wherein the at least one LED comprises a plurality of LEDs, and thesubstrate includes a plurality of non-coplanar LED support surfacesadapted to support the plurality of LEDs.
 9. The LED light engine ofclaim 1, wherein the substrate comprises at least one edge connectoradapted to engage at least one electrical contact of a socket or fixtureto supply electric current to the at least one LED.
 10. A LED light bulbcomprising the LED light engine of claim
 1. 11. The LED light bulb ofclaim 10, including a base end comprising a plurality of electricalcontacts arranged to mate with an electrical receptacle to receiveelectric current, wherein the plurality of electrical contacts arearranged to supply electric current to the LED light bulb.
 12. The LEDlight bulb of claim 10, further comprising a cover defining an interiorvolume, wherein the at least one LED is disposed within the interiorvolume.
 13. The LED light bulb of claim 10, wherein the cover comprisesany of a diffuser, a lens, and a lumiphoric material.
 14. The LED lightbulb of claim 12, wherein the cover comprises a plurality of openings toenable air or other fluid to flow between the interior volume and anambient environment.
 15. The LED light bulb of claim
 12. wherein atleast a portion of the cover comprises a material having visiblespectrum transmittance of least about 80% and a thermal conductivity ofat least 25 W/(m·° K) at about 25° C., and the cover is in conductivethermal communication the at least one LED.
 16. A method utilizing theLED light bulb of claim 10, comprising supplying electric current to theat least one electrical trace to illuminate the at least one LED.
 17. Amethod comprising: patterning a substantially planar substrate to defineat least one electrical trace for at least one light emitting diode(LED); mounting at least one LED to the substrate; and shaping thesubstrate to define at least one bend therein to form at least onesubstantially rigid upright support structure for the at least one LED.18. The method of claim 17, wherein the at least one electrical tracecomprises a plurality of electrical traces for the at least one LED andfor at least one electrical circuit element associated with the at leastone LED.
 19. The method of claim 18, wherein the at least one electricalcircuit element comprises at least one of a LED drive circuit elementand a LED control circuit element, the method further comprisingmounting to, defining in, or defining on the substrate the at least oneof a LED drive circuit element and a LED control circuit element. 20.The method of claim 17, wherein the substrate comprises a metal coreprinted circuit board.
 21. The method of claim 17, wherein the substratecomprises a heatsink portion, the method further comprising mounting theat least one LED to the substrate in conductive thermal communicationwith the heatsink portion.
 22. The method of claim 17, wherein theshaping of the substrate is performed after the mounting of the at leastone LED to the substrate.
 23. The method of claim 17, wherein the atleast one LED comprises a plurality of LEDs, and the shaping of thesubstrate includes forming a plurality of non-coplanar LED supportsurfaces adapted to support the plurality of LEDs.
 24. The method ofclaim 17, further comprising arranging a cover that is at leastpartially transmissive of visible wavelengths over the substantiallyrigid upright support structure.
 25. The method of claim 17, furthercomprising forming on the substrate at least one edge connector adaptedto engage at least one electrical contact of a socket or fixture tosupply electric current to the at least one LED.
 26. The method of claim17, wherein the at least one trace comprises a plurality of electricaltraces for a plurality of LEDs and for a plurality of electrical circuitelements, the method further comprising cutting the substrate into aplurality of segments, and shaping the plurality of segments to defineat least one bend in each segment to form a plurality of substantiallyrigid upright support structures for the plurality of LEDs.
 27. A lightemitting diode (LED) light bulb comprising: a cover defining an interiorvolume, wherein at least a portion of the cover comprising a materialhaving visible spectrum transmittance of least about 80% and a thermalconductivity of at least 25 W/(m·° K) at about 25° C.; and a substratesupporting at least one LED, wherein the at least one LED and at least aportion of the substrate are disposed within the interior volume. 28.The LED light bulb of claim 27, wherein said material has a thermalconductivity of at least about 100 W/(m·° K) at about 25° C.
 29. The LEDlight bulb of claim 27, wherein the cover comprises a plurality of fins.30. The LED light bulb of claim 29, wherein the fins are formed bysintering.
 31. The LED light bulb of claim 27, wherein the cover servesas an optical diffuser or at least one lens.
 32. The LED light bulb ofclaim 27, wherein the cover has associated therewith a lumiphoricmaterial arranged to downconvert emissions from the at least one LED.33. The LED light bulb of claim 27, wherein substantially all of thecover comprises said material having visible spectrum transmittance ofleast about 80% and a thermal conductivity of at least 25 W/(m·° K) atabout 25° C.
 34. The LED light bulb of claim 27, wherein the covercomprises at least one opening to enable air or other fluid to flowbetween the interior volume and an ambient environment.
 35. The LEDlight bulb of claim 34, further comprising at least one baffle arrangedto prevent unobstructed visibility of the at least one LED through theat least one opening.
 36. The LED light bulb of claim 35, wherein the atleast one baffle is arranged within the interior volume.
 37. The LEDlight bulb of claim 27, wherein the cover comprises a first portioncomprising said material having visible spectrum transmittance of leastabout 80% and a thermal conductivity of at least 25 W/(m·° K), and asecond portion having a visible spectrum transmittance of less thanabout 80% and a thermal conductivity of greater than 25 W/(m·° K),wherein the first portion and the second portion are coupled along aninterface arranged to promote conductive heat transfer between the firstportion and the second portion.
 38. The LED light bulb of claim 27,wherein the at least one LED further comprising a heat spreader arrangedin conductive thermal communication with the at least one LED and inconductive thermal communication with the cover.
 39. The LED light bulbof claim 27, further comprising: at least one electrical conductorarranged to supply electric current to the at least one LED; and atleast one electrical contact arranged to mate with an electricalreceptacle to receive electric current, wherein the at least oneelectrical contact is in electrical communication with the at least oneelectrical conductor.
 40. A light emitting diode (LED) light bulbcomprising: a cover defining an interior volume, the cover comprising amaterial adapted to transmit at least a portion of light in the visiblespectrum; at least one LED disposed within the interior volume; asupport column comprising a plurality of electrical conductors inelectrical communication with the at least one LED; and first and secondelectrical contacts disposed in or on the support column and arranged tomate with an electrical receptacle to receive electric current, whereinthe first and second electrical contacts are in electrical communicationwith the plurality of electrical conductors; wherein a portion of thesupport column is disposed outside of the interior volume and is exposedto an ambient environment.
 41. The LED light bulb of claim 41, furthercomprising a substrate within the interior volume, wherein the at leastone LED is arranged on or over the substrate, and the substrate issupported by the support column.
 42. The LED light bulb of claim 40,wherein the at least one LED comprises a plurality of LEDs.
 43. The LEDlight bulb of claim 40, wherein the at least one LED comprises lighthaving at least one peak wavelength, and the cover comprises at leastone lumiphoric material adapted to receive light from the at least oneLED and responsively emit light having at least one other peakwavelength that differs from the at least one peak wavelength.
 44. TheLED light bulb of claim 40, wherein: at least a portion of the supportcolumn has a hollow core; the support column defines at least one firstopening disposed within the interior volume and arranged for passage offluid; the support column defines at least one second opening disposedoutside of the interior volume and exposed to an ambient environment;and each of the at least one first opening and the at least one secondopening is in fluid communication with the hollow core.
 45. The LEDlight bulb of claim 40, wherein the support column comprises at leastone heat transfer device arranged to promote dissipation of heat fromthe substrate to the ambient environment.
 46. The LED light bulb ofclaim 45, wherein the at least one heat transfer device comprises a fan.47. The LED light bulb of claim 45, wherein the at least one heattransfer device comprises a heatpipe.
 48. The LED light bulb of claim45, wherein the at least one heat transfer device comprises a pluralityof fins.
 49. The LED light bulb of claim 40, further comprising a capdisposed along an end of the support column distal from the substrate,wherein the cap includes the first and second electrical conductors. 50.The LED light bulb of claim 40, wherein at least an outer portion of thesupport column comprises an electrically insulating material.
 51. TheLED light bulb of claim 50, wherein the support column comprises anelectrically conductive inner portion, and the electrically insulatingmaterial comprises a coating or covering disposed over the electricallyconductive inner portion.
 52. The LED light bulb of claim 40, wherein atleast a portion of the cover comprises a material having visiblespectrum transmittance of least about 80% and a thermal conductivity ofat least 25 W/(m·° K) at about 25° C.
 53. A light emitting diode (LED)light bulb comprising: a cover defining an interior volume, the covercomprising a material adapted to transmit at least a portion of light inthe visible spectrum; a substrate supporting at least one LED, whereinthe at least one LED and at least a portion of the substrate aredisposed within the interior volume; and at least one opening defined inthe cover, wherein the at least one opening is in fluid communicationwith an ambient environment.
 54. The LED light bulb of claim 53, furthercomprising at least one baffle arranged to prevent unobstructedvisibility of the at least one LED through the at least one opening. 55.The LED light bulb of claim 54, wherein the at least one baffle isarranged within the interior volume.
 56. The LED light bulb of claim 53,wherein the cover comprises a plurality of openings to enable air orother fluid to flow between the interior volume and an ambientenvironment.
 57. The LED light bulb of claim 53, further comprising atleast one additional opening defined in at least one of (a) the coverand (b) a base portion of the light bulb disposed outside the cover. 58.The LED light bulb of claim 57, further comprising a fluid circulationelement adapted to cause air or other fluid to flow through the at leastone opening and the at least one additional opening.
 59. The LED lightbulb of claim 53, further comprising a filter element arranged inhibitpassage of dust or other particulate matter through the at least oneopening.
 60. The LED light bulb of claim 59, further comprising at leastone sensor arranged to sense a condition indicative of a need for thefilter element to be cleaned or changed.